JPH0157502B2 - - Google Patents

Info

Publication number
JPH0157502B2
JPH0157502B2 JP55024689A JP2468980A JPH0157502B2 JP H0157502 B2 JPH0157502 B2 JP H0157502B2 JP 55024689 A JP55024689 A JP 55024689A JP 2468980 A JP2468980 A JP 2468980A JP H0157502 B2 JPH0157502 B2 JP H0157502B2
Authority
JP
Japan
Prior art keywords
heat dissipation
heat
semiconductor device
heat transfer
motherboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55024689A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56122149A (en
Inventor
Tetsushi Wakabayashi
Norio Pponda
Osamu Sakuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2468980A priority Critical patent/JPS56122149A/ja
Priority to IE415/81A priority patent/IE52448B1/en
Priority to IE1626/86A priority patent/IE52449B1/en
Priority to EP81300835A priority patent/EP0035390B1/en
Priority to DE8282200051T priority patent/DE3174596D1/de
Priority to EP82200051A priority patent/EP0054539B1/en
Priority to DE8181300835T priority patent/DE3166106D1/de
Publication of JPS56122149A publication Critical patent/JPS56122149A/ja
Priority to US06/620,522 priority patent/US4535384A/en
Publication of JPH0157502B2 publication Critical patent/JPH0157502B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2468980A 1980-02-29 1980-02-29 Heat dissipating structure for semiconductor device Granted JPS56122149A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2468980A JPS56122149A (en) 1980-02-29 1980-02-29 Heat dissipating structure for semiconductor device
IE415/81A IE52448B1 (en) 1980-02-29 1981-02-26 A semiconductor integrated circuit device with an improved heat sink
IE1626/86A IE52449B1 (en) 1980-02-29 1981-02-26 A semiconductor integrated circuit device with an improved heat sink
EP81300835A EP0035390B1 (en) 1980-02-29 1981-02-27 A semiconductor integrated circuit device with an improved heat sink
DE8282200051T DE3174596D1 (en) 1980-02-29 1981-02-27 A semiconductor integrated circuit device with an improved heat sink
EP82200051A EP0054539B1 (en) 1980-02-29 1981-02-27 A semiconductor integrated circuit device with an improved heat sink
DE8181300835T DE3166106D1 (en) 1980-02-29 1981-02-27 A semiconductor integrated circuit device with an improved heat sink
US06/620,522 US4535384A (en) 1980-02-29 1984-06-12 Heat sink for a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2468980A JPS56122149A (en) 1980-02-29 1980-02-29 Heat dissipating structure for semiconductor device

Publications (2)

Publication Number Publication Date
JPS56122149A JPS56122149A (en) 1981-09-25
JPH0157502B2 true JPH0157502B2 (en]) 1989-12-06

Family

ID=12145128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2468980A Granted JPS56122149A (en) 1980-02-29 1980-02-29 Heat dissipating structure for semiconductor device

Country Status (5)

Country Link
US (1) US4535384A (en])
EP (2) EP0035390B1 (en])
JP (1) JPS56122149A (en])
DE (1) DE3166106D1 (en])
IE (1) IE52448B1 (en])

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169943A (ja) * 1982-03-29 1983-10-06 Fujitsu Ltd 半導体装置
JPS6057956A (ja) * 1983-09-09 1985-04-03 Furukawa Electric Co Ltd:The 半導体用ヒ−トパイプ放熱器
JPS60148154A (ja) * 1984-01-13 1985-08-05 Nissan Motor Co Ltd トランジスタ保護装置
USD316705S (en) 1989-01-13 1991-05-07 Product R&D Corporation Combined heat sink and radiator for electronic equipment
EP0435155B1 (en) * 1989-12-29 1994-06-01 Sumitomo Electric Industries, Ltd. Radiating fin having improved life and thermal conductivity
US5050039A (en) * 1990-06-26 1991-09-17 Digital Equipment Corporation Multiple circuit chip mounting and cooling arrangement
US5459638A (en) * 1990-09-13 1995-10-17 Fujitsu Limited Semiconductor device with heat radiating fin assembly and container for housing the same
US5654587A (en) * 1993-07-15 1997-08-05 Lsi Logic Corporation Stackable heatsink structure for semiconductor devices
US5773886A (en) * 1993-07-15 1998-06-30 Lsi Logic Corporation System having stackable heat sink structures
US5693981A (en) * 1993-12-14 1997-12-02 Lsi Logic Corporation Electronic system with heat dissipating apparatus and method of dissipating heat in an electronic system
US5514327A (en) * 1993-12-14 1996-05-07 Lsi Logic Corporation Powder metal heat sink for integrated circuit devices
SE506348C2 (sv) * 1996-04-01 1997-12-08 Tetra Laval Holdings & Finance Förpackningsmaterialbana för en självbärande förpackningsbehållarvägg jämte av banan tillverkad förpackningsbehållare
US5957194A (en) 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
DE19701680C2 (de) * 1997-01-18 2001-08-02 Fraunhofer Ges Forschung Diamantkörper
US6301779B1 (en) 1998-10-29 2001-10-16 Advanced Thermal Solutions, Inc. Method for fabricating a heat sink having nested extended surfaces
US6308771B1 (en) 1998-10-29 2001-10-30 Advanced Thermal Solutions, Inc. High performance fan tail heat exchanger
TW518733B (en) * 2000-04-08 2003-01-21 Advanced Semiconductor Eng Attaching method of heat sink for chip package
US6538892B2 (en) * 2001-05-02 2003-03-25 Graftech Inc. Radial finned heat sink
DE10326087B4 (de) * 2003-06-10 2008-03-20 Infineon Technologies Ag Bauelement mit einer Nutzstruktur und einer Hilfsstruktur
US7679096B1 (en) * 2003-08-21 2010-03-16 Opto Technology, Inc. Integrated LED heat sink
TWM289572U (en) * 2005-10-05 2006-04-11 Inventec Corp Heat sink
US8587114B2 (en) 2010-10-05 2013-11-19 International Business Machines Corporation Multichip electronic packages and methods of manufacture
US9137925B2 (en) * 2013-05-08 2015-09-15 Hamilton Sundstrand Corporation Heat sink for contactor in power distribution assembly
US9398723B2 (en) 2013-08-29 2016-07-19 Eaton Corporation Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat
CN105261598B (zh) 2014-07-16 2018-11-13 恩智浦美国有限公司 具有基于管道的散热器的半导体器件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1773097U (de) * 1958-01-15 1958-08-28 Bbc Brown Boveri & Cie Anordnung fuer die kuehlung von halbleiterelementen.
CH416844A (de) * 1964-03-09 1966-07-15 Secheron Atel Halbleiteranordnung mit Kühlkörper
US3406753A (en) * 1967-02-23 1968-10-22 Calumet & Hecla Peg type heat exchangers for thermoelectric devices
US3435891A (en) * 1967-03-23 1969-04-01 Int Rectifier Corp Air flow baffle for rectifier heat exchanger
US3457988A (en) * 1967-05-15 1969-07-29 Westinghouse Electric Corp Integral heat sink for semiconductor devices
US4000509A (en) * 1975-03-31 1976-12-28 International Business Machines Corporation High density air cooled wafer package having improved thermal dissipation
US4034468A (en) * 1976-09-03 1977-07-12 Ibm Corporation Method for making conduction-cooled circuit package
US4069498A (en) * 1976-11-03 1978-01-17 International Business Machines Corporation Studded heat exchanger for integrated circuit package
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4292647A (en) * 1979-04-06 1981-09-29 Amdahl Corporation Semiconductor package and electronic array having improved heat dissipation
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips

Also Published As

Publication number Publication date
EP0054539A2 (en) 1982-06-23
EP0035390B1 (en) 1984-09-19
JPS56122149A (en) 1981-09-25
EP0054539A3 (en) 1983-02-16
EP0035390A1 (en) 1981-09-09
EP0054539B1 (en) 1986-05-07
IE52448B1 (en) 1987-11-11
IE810415L (en) 1981-08-29
US4535384A (en) 1985-08-13
DE3166106D1 (en) 1984-10-25

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